Ɲininikalan jɛkulu dɔ min ɲɛmɔgɔya bɛ Prof bolo.Huang Xingyi .aniDɔgɔtɔrɔ Shi Kunming .ka bɔShanghai Jiao Tong Iniwɛrisite .a ye a yiriwa .Multilayer thermal conductif ani kuran insulating tape (MTCEIT) .. O ko kura in bɛ Kɛ sababu ye ka CPU funteni dɔgɔyali Kɛ fo ka Se fo .9℃., ka fura kura di funteni jɛnsɛnni ma ɛntɛrinɛti minɛnw kɔnɔ minnu ka surun.
MTCEIT ka sanwiziw .Graphene papier .(High Thermal Conductivity Core) ni ɲɔgɔn cɛ .BNNS-PBCOEA la layɛrɛw falen ., o faralen don ɲɔgɔn kan ni a ye .Silikoni ka lastikuw (SR) Kosɛbɛ kɔkanna .a falen bɛ .Nitride boron hexagonal (H{0}}BN) .Flakes. ni a janya bɛ se ka kɛ .300 μm, kasɛti bɛ se ka .in-plan thermal conductivité de 121,22 w/m·k, a Volume resistivité de 5,07×101 Ω·cm ., ani a .Weibull jogo tiɲɛni fanga min bɛ 36,9 kv/mm ..
Tiɲɛ na-Duniɲa sɛgɛsɛgɛliw la, Mtceit ye dɔ bɔ .CPU funteni hakɛ ordinatɛri finmanw na ni degere 9 ye .ani sabatili .Wideyo karamɔgɔya jiginni min ka dɔgɔ walima min bɛ bɛn 0,1 fps ma .in ultra-Smartphones thin sans active cooling.
Kalan min tɔgɔ ye ko ."Paper graphene-based multilayer thermal conductive tapes with exceptionnel électrique insulation pour la haute chaud flux dissipation,"a bɔra san 2019 kɔnɔ.Baarakɛminɛnw ɲɛtaa (AFM) ..
Jaa 1. MTCEIT ka dilancogo.
(a) Sumaya jɛnsɛnni sira misali sɛmɛnen ɛntɛrinɛti minɛnw kɔnɔ minnu bɛ MTCEIT kɔnɔ.
(b) Kasew ka sanfɛ funteni tilatilali ni fɛnw ye minnu tɛ kelen ye u jɔlenw kɔrɔ-state conditions in finite element simulations.
(C–E) Funteni sɔrɔyɔrɔ ka funteni hakɛ maksimali la, fɛn dantigɛlenw ka simulasiw kɔnɔ i n’a fɔ (c) layɛrɛ kelen-kelen bɛɛ ka baarakɛcogo, (d) in-plane (κ//) ani ka tɛmɛ{1}}plan (κ⊥) la, layɛrɛ nɔrɔlenw ka funteni taabolo la, ani (e) layɛrɛ adɛsi ni a lamini cɛ, a bɛ kɛ cogo min na, a bɛ kɛ cogo min na, o bɛ kɛ cogo min na, ani (E) la, a bɛ se ka kɛ ko a bɛ se ka kɛ ko a bɛ se ka kɛ ko a bɛ se ka kɛ ko a bɛ se ka kɛ ko a bɛ se ka kɛ ko a bɛ se ka kɛ ko a bɛ se ka kɛ ko a bɛ se ka kɛ ko a bɛ se ka kɛ ko a bɛ se ka kɛ ko a bɛ se ka kɛ. a nɔrɔlen layɛrɛ ani a kɔkanna layɛrɛ .
Jaa 2. MTCEIT ka sigicogo n’a ka masina cogoyaw.
(a) MTCEIT ni jago grafɛnɛ papiye ja ɲɛnamaw.
(b) Cross-Sectional ani (c) Interlayer compact contact SEM ja minnu bɛ MTCEIT la.
(d) EDS spectre ani (e) XRD misali Mtceit.
(f) Kɔrɔta ani (g) Mtceit cogoyaw cogoya.
(h) tension stress–strain curve de la Mtceit.
Jaa 3. MTCEITw ka funteni-taama-cogo ani kuran-sɔgɔli.
Jaa 4. Laptop finman dɔ ka funteni bɔli.
(a) Ja min bɛ kɛ ni ɔridinatɛri ye, o ja ɲɛnama. MTCEIT hakɛ ye milimɛtɛrɛ 130 × 60 ye.
(b) CPU funteni jɛnsɛnni sira nɔgɔman misali sɛmɛnen.
(c) Infrarouge ja minnu bɛ sɔrɔ ordinatɛri la.
(d) funteni caman ɲɔgɔnna ani (e) CPU funteni s 1200 na. Inset in (d) bɛ ɔridinatɛri kɔrɔbɔlen ja ɲɛnama jira.
Sɛgɛsɛgɛliw bɛɛ kɛra baarakɛcogo la min bɛ kɛ cogoya la. Funteni jateminɛna ni-CPU sensɛri jɔlen ye ani a kɔlɔsira ni AIDA64 Extreme porogaramu ye.
Jaa 5. Ultra-Smartfon ultra dɔ ka funteni bɔli ni nɛnɛba tɛ.
